An all copper Fabfin® heat sink provides maximum forced air cooling performance. While copper provides outstanding performance, the overall cost is high. Other fin spacing can be provided when fins are silver soldered into slots. No glue is used in the process.
Developed and patented by Mersen, our swaging process boosts the efficiency of air cooled heat sinks with thinner, longer fins on denser or mixed metals to get maximum thermal conductivity while keeping weight down. The swaging technology used on our Fabfin® heat sinks eliminates bonding or gluing interfaces between fins and base plate thus providing a much more robust design, suitable for use in higher operating temperature in Silicon Carbide (SiC) Applications. The glue-less swaging design ensure long life time in harsh environments.